Markus Arendt
SUSS MicroTec Photonic Systems, Inc., Corona, CA, USA

Alastair Attard
BESI, Austria

Kemal Aygun
Intel Corporation, Chandler, AZ, USA

Muhannad S. Bakir
Electrical and Computer Engineering, Georgia Institute of Technology

Tanja Braun
Fraunhofer IZM, Berlin, Germany

José Castro
Amkor Technology Portugal S.A., Portugal

Otto Cheung
ASM Pacific Technology

Markus Cichon
Nagase (Europa) GmbH

Ashish Dhall
Intel Corporation, Chandler, AZ, USA

T. Enomoto
HDMicroSystems

Nelson Fan
ASM Pacific Technology

Edward Fürgut
Infineon Technologies AG

Ricardo Gaio
Amkor Technology Portugal S.A., Portugal

Thomas Gottwald
Schweizer Electronic AG, Schramberg, Germany

Habib Hichri
SUSS MicroTec Photonic Systems, Inc., Corona, CA, USA

Ron Huemoeller
Amkor Technology, Inc.

Dimitri Janssen
Fujifilm Electronic Materials, NV

Paul K. Jo
Electrical and Computer Engineering, Georgia Institute of Technology

Chris Jones
SPTS Technologies Ltd, Newport, UK

Katsushi Kan
Nagase ChemteX Corporation

Akio Katsumata
J‐Devices

Jong Heon (Jay) Kim
nepes Corporation

Steffen Kroehnert
Amkor Technology Holding B.V., Netherlands

Eric Kuah
ASM Pacific Technology

Klaus‐Dieter Lang
Fraunhofer IZM, Berlin, Germany

Seongkuk Lee
SUSS MicroTec Photonic Systems, Inc., Corona, CA, USA

Ravi Mahajan
Intel Corporation, Chandler, AZ, USA

Debendra Mallik
Intel Corporation, Chandler, AZ, USA

J.I. Matthews
HDMicroSystems

Harald Meixner
BESI, Austria

Thorsten Meyer
Infineon Technologies AG, Germany

T. Motobe
HDMicroSystems

Alexander Neumann
Schweizer Electronic AG, Schramberg, Germany

Eric Ng
ASM Pacific Technology

Tim Olson
Deca Technologies

Hirohito Oshimori
Apic Yamada Corporation

Andreas Ostmann
Fraunhofer IZM, Berlin, Germany

Boris Plikat
Infineon Technologies AG, Regensburg, Germany

Boris Považay
EV Group, St. Florian am Inn, Austria

Hugo Pristauz
BESI, Austria

Zhiguo Qian
Intel Corporation, Chandler, AZ, USA

Christian Roessle
Schweizer Electronic AG, Schramberg, Germany

Jonathan Rosch
Intel Corporation, Chandler, AZ, USA

Islam Salama
Intel Corporation, Chandler, AZ, USA

Robert Sankman
Intel Corporation, Chandler, AZ, USA

Chris Scanlan
Deca Technologies

Thorsten Scharf
Infineon Technologies AG, Regensburg, Germany

Michiyasu Sugahara
Nagase & Co., LTD

Tomoko Takahashi
J‐Devices

Paragkumar A. Thadesar
Electrical and Computer Engineering, Georgia Institute of Technology

Michael Töpper
Fraunhofer IZM, Berlin, Germany

Thomas Uhrmann
EV Group, St. Florian am Inn, Austria

Stefan Vanclooster
Fujifilm Electronic Materials, NV

E. Jan Vardaman
TechSearch International, Inc., Austin, TX, USA

Hiroaki Yamagishi
Apic Yamada Corporation

S.W. Yoon
STATS ChipPAC, JCET Group

Daquan Yu
Huatian Technology (Kunshan) Electronics Co., Ltd., Economic & Technical Development Zone, Kunshan, Jiangsu, China

Curtis Zwenger
Amkor Technology, Inc.