Index
Note: Page numbers followed by f indicate figures and t indicate tables.
A
Alternating current (AC) electrodeposition
26–28,
69–72
magnetoimpedance (MI) effect
532–535
ALD and lithography
18–20
diameter modulation
14–17
direct current (DC) power supply
Ni–Co alloy structures
180
Asymmetric magnetoimpedance (AMI)
300–301
B
center to surface techniques
277–280
glass-coated microwire precursors
276
hard/soft FePt/FeNi biphase system
287–288
inductive fluxmetric techniques
285
soft/hard CoFe/CoNi biphase system
286–288
soft/soft FeSiBP/FeNi biphase system
288
sputtering and electrodeposition techniques
276
vibrating sample magnetometer
285
center to surface techniques
280–285
spin-valve-like system, development of
302–303
cell trapping and separation
612–614
cell uptake and cytotoxicity
619–620
conventional organic fluorophore
601–602
living cells, mechanical stress
615–619
surface modification
600f
C
Chemical vapor transport (CVT)
demagnetization process
51–52
geometric parameter
52–53
high-resolution transmission electron microscopy
53
magnetization reversal mechanism
155–156
magnetocrystalline anisotropy
52–53
micromagnetic simulations
50–51
X-ray diffraction patterns
48–50,
53
DC electrodeposition
71–72
high-resolution transmission electron microscopy
70–71
longitudinal hysteresis loops
72f
multilayered nanowires
85–87
CoFeB–MgO structures, domain wall motion
edge roughness, influence of
350–351
magnetic wires, nanofabrication of
341–344
electrical analysis of
506
Conductive atomic force microscopy (C-AFM)
494–495
Co–Ni/Cu multilayered nanowires
90–92
crystalline anisotropy constant
62
fabrication and magnetic characterization
55
magnetoelastic anisotropy
62
magneto-optic Kerr effect magnetometry
55–56
magnetothermal and magnetotransport properties
62
Slater-Pauling curve
55–56
temperature dependence
61
Crossbar nanowire memory array
501–503
Current-induced domain wall (CIDW)
D
Dipole–dipole interactions
437,
614f
Direct current (DC) electrodeposition method
730–731
magnetization switching
255
magnetoelastic anisotropy effects
256–259
MOKE and Sixtus–Tonks method
217
Dzyaloshinskii–Moriya interaction (DMI)
314,
356
E
Electrochemical anodization process
diameter modulation
14–17
Electrochemical deposition
AC electrodeposition
26–28
galvanostatic electrodeposition
25
potentiostatic electrodeposition
25
pulsed electrodeposition
25–26
three-electrode electrochemical cell
23–24,
23f
Electromagnetic waves (EMWs)
Floquet channels (FAB)
711
Maxwell–Garnett formula
710
nonreciprocal microwave devices
706–708
propagation and diffraction effects
688–689
self-biased planar microwave circuit
706–708
3-D magnetic nanocomposite
711
unbiased microwave circulator
706–708
Ethylenediaminetetraacetic acid (EDTA)
740
F
Face-centered cubic (FCC) disorder
278–280
anisotropic magnetic behavior
77
bright field-dark field images
74–75,
75f
coercivity and squareness
77,
78f
geometric characteristics
78–79
magnetic characterization
76
structural and magnetic characterization
79
coercivity and squareness
67f
magnetic characterization
67–68
magnetocrystalline anisotropy
65
micromagnetic simulations
68
Ferromagnetic metals, FMR
boundary conditions and surface impedance
454–455
exchange-conductivity effects
453–454
linearized LLG equation
451
Ferromagnetic resonance (FMR)
electric transport properties
459–460
metallic wires, electric polarization of
455–457
Suhl spin-wave instabilities
474–476
cross-sectional TEM analyses
190–191
crystal atomic configuration
191–192
SiO
2 layer, formation of
193
temperature profile and annealing
192f
vapor–solid growth mechanism
192
Field-assisted dissolution (FAD)
8–9
First-order magneto-structural transition (FOMT)
570
Focused electron beam-induced deposition (FEBID)
domain walls, in planar nanowires
157–165
scanning electron microscope
148
G
Galvanostatic electrodeposition
25
Giant magnetocaloric effect (GMCE)
569–570
Giant magneto impedance (GMI) effect
403,
449,
574
giant magnetoimpedance effect
239f
gigahertz frequencies
235
industrial application
233
partial crystallization and nanocrystallization
248–254
stress-annealed Fe-rich microwires
247
surface impedance tensor
234
Glass-coated melt spinning method
200
H
Hard anodization (HA)
12–13
Heterogeneous ferromagnetic nanowires
anodic aluminum oxide template filling
114–115
composition modulation
112
nanoimprint and lithographic techniques
108
oxide-metal interface
108
pore widening and third anodization
110
Heusler glass-coated microwires
I
In-rotating-water quenching technique
277–278
electrochemical conditions
44–45
Fe(III) formation/precipitation
45–46
industrial production of
44–45
longitudinal coercive field
47f
longitudinal hysteresis loops
47f
saturation magnetization
46
K
L
Landau–Lifshitz–Bloch (LLB) equation
440–441
Landau–Lifshitz (LL) equation
657–658
Laser interference lithography (LIL)
19–20
Light-emitting diodes (LEDs)
135–137
LLG Micromagnetics Simulator
442
Longitudinal magneto-optical Kerr effect (LMOKE)
surface domains, schematic configuration of
411–412,
412f
M
Magnetic content addressable memory (MCAM)
371–372,
372f
composite testing, stress MI for
535–537
nanocrystalline soft magnetic materials
225
Au nanoparticle precipitation
607–608
configurational phase transitions
685–688
hard magnetic segments
606
hybrid nano-magneto-optical devices
589–590
permalloy nanowire sample
680f
static dipolar interaction effects
684–685
template-assisted electrodeposition
593–596
cylindrical magnetic nanowires
423–424
single domain wall, nucleation and depinning of
379–382
Magnetocaloric effect (MCE)
adiabatic demagnetization
570
adiabatic magnetization
569
Magnetocrystalline anisotropy (MA)
magnetization reversal process
89–90
magnetostatic energy calculation
424
3-D metals and alloys
630
Magnetoimpedance (MI) effect
Magneto-optical Kerr effect (MOKE)
155
magnetic fields and light distribution in
404
modified Sixtus–Tonks method
418–420
Magnetostrictive microwires, domain walls
injected domain walls (DW
inj)
392–396
reverse domain wall (DW
rev)
391–392
Micromagnetic simulations
analytical calculations
424
Bloch-point domain walls
425
coherent rotation, Stoner-Wohlfarth model
424
curling reversal mode
424
electron-assisted deposition
423
fine micromagnetic features
802–803
individual NWs and NW arrays, hysteresis loops
437–439
LLG Micromagnetics Simulator
442
mean diameter and aspect ratio
636
multilayered Co/Cu/Co NWs
440
shape magnetic anisotropy
429
magnetocrystalline anisotropy energy
655–657
constant magnetization length
426
ferromagnetic element, total energy of
426
Landau–Lifshitz–Gilbert equation
427
Microwave tunable composites
fibre-matrix bond strength
541
fibre-reinforced plastic composites
537–538
free space measurement methods
540,
541f
stress transfer mechanisms
541
structural health monitoring
537–538
tensile stress, application of
540–541
AC and pulsed deposition techniques
12
conditions and morphological features
10t
DC electrodeposition techniques
11–12
nanoporous alumina films
7–8
pore self-organization
10f
Modified small-angle magnetization rotation (MSAMR) technique
300
Multilayered magnetic nanowires
Co–Ni/Cu multilayer nanowires
90–92
Co–Ni multisegmented nanowires
87–90
Co/Pt multilayer nanowires
92
N
angular dependence of coercivity
753–755
applied rotating electric field
745
deposition current densities, tuning of
737–738
electrochemical deposition, porous template for
728,
729f
electrolyte solution, influence of
734–735
ion track-etched polymers
728,
730f
magnetostatic interactions, FORC diagrams
755–756,
757f
nanochannel membranes
746
pore fabrication process
728
pore walls, functionalization of
735–736
surface-to volume ratio
727
temperature-dependent magnetic properties
760–761
template assisted methods
728
working electrode thickness
743
actual packing density
645
structural characterizations
643–645
Nanowire heterostructures
optoelectronic applications
135–140
Network-analyzer ferromagnetic resonance (NA-FMR)
458–459,
459f
Nickel (Ni) nanowires
53–55
fast Fourier transform patterns
175–177
Nitrogen-vacancy (NV) center microscopy
348–350
Nonequilibrium spin polarization
Nonlinear ferromagnetic resonance
482
amorphous microwires, subsidiary absorption in
476–477
Suhl spin-wave instabilities
474–476
conventional resistive memory
490f
flash NAND memory and hard disks, limitations of
333–334
3-D flash memory architecture
489
O
Object-Oriented MicroMagnetic Framework (OOMMF)
441–442,
760
One-dimensional (1-D) systems
Oxide nanowire, resistive memory
bottom-up oxide nanowire
518
nanowire alignment methods
519
P
Parallel configuration (PC)
Parallel Finite Element Micromagnetics Package (MAGPAR)
442
Permanent magnet fabrication
transverse
vs. vortex walls
790–791
Physical vapor deposition (PVD)
336
nucleation and propagation fields
158
Polar magneto-optical Kerr effect (PMOKE)
surface domains, schematic configuration of
411–412,
412f
Polycarbonate track-etching membrane
728,
730f
Polyethylene glycol (PEG)
735
nickel and cobalt spherical particles
630
Potentiostatic electrodeposition
25,
735
Pulsed electrodeposition
25–26
Pulsed laser deposition (PLD) technique
494
Q
Quasi-static (QS) approximation
468–470
R
Random access memory (RAM)
429
Rashba spin–orbit interaction
anionic and cationic memory, characteristics of
498–499,
499t
Au–NiO–Au multisegmented nanowire devices
499–500,
500f
crossbar nanowire memory array
501–503
Cu/Zn
2SnO
4 nanowires/Pd device
498,
498f
electrical breakdown phenomenon
490–491
in situ analysis, TEM/EDS observation
514–518
nanoscale resistive switching, stability of
510–513
nanowire/electrode contact
518
nanowire/metal interface
518
S
domain walls, length and energy of
805–806
transverse
vs. vortex walls
803–804
injected domain walls (DW
inj)
392–396
reverse domain wall (DW
rev)
391–392
Sixtus–Tonks technique
256
current-induced effective field, evaluation of
319–321
magnetic chirality, determination of
324–327
sample preparation and experimental methods
319
Seebeck and spin Seebeck effects
559–560
displacement of domain walls
356–359
magnetization switching
356
Spin transfer torque (STT)
multilayered nanowires and magnetic nanotubes
702–705
spin reorientation transition
691–692
Spin-wave resonances (SWRs)
454
Static random access memory (SRAM)
371
Structure inversion asymmetry (SIA)
356
T
anodic Al
2 O
3 templates
6–20
electrochemical deposition
21–28
polymeric track-etched membranes
5–6
Thermal spin polarization
Seebeck and spin Seebeck effects
559–560
Three dimensional (3-D) flash memory
489
Transition metal and alloys
FTM/Pd-based alloys
80–83
Transversal configuration (TC)
Transversal magneto-optical Kerr effect (TMOKE)
torsion-induced surface helical anisotropy
408,
409f
Two-dimensional (2-D) electron gas
V
Vapour–liquid–solid (VLS) mechanism
494
X