Index
Note: Page numbers followed by “f” and “t” refers to figures and tables respectively.
A
Acousto-optic frequency shifter,
100
Active vibration isolation,
58
Amplitude distribution curve,
254,
258
Amplitude profile parameters,
249–251
Amplitude–wavelength space,
135–136
Analogue-to-digital converter,
100–101
Angular distribution of scatter,
174–175
Areal specification standards,
264–267
Area-scale fractal complexity,
288
Arithmetic mean of the absolute height,
268
Arithmetic mean peak curvature,
281
Arithmetical mean deviation of the assessed profile,
252–253
Articulated-arm CMMs,
300
Atomic lattice parameter,
125
Auto-correlation function,
269
B
Backscattered electrons,
228
Balanced interferometers,
109
Bearing length ratio,
256
Bi-directional fringe counting,
97–98
Bidirectional scatter distribution function,
172–173
Bureau International des Poids et Mesures,
14,
330
C
Calibration of a laser’s frequency,
34–35
Capacitive displacement sensors,
115–116
Capacitive instruments,
175
Cartesian coordinates,
43,
296
Central limit theorem,
25,
26
Charge on an electron,
14–15
Chemical force microscopy,
223
Chemical vapour deposition,
223–224
Coefficient of friction,
222
Coefficient of linear thermal expansion,
104
Coefficient of thermal expansion,
85–86
Combined Optical and X-ray Interferometer,
126
Commercial interferometers,
109
Computer-aided accuracy correction field,
320
Computer-aided design,
297
Co-nanomet,
Conférence Générale des Poids et Mesures,
Core material volume,
273
Coverage interval,
23,
23
CSI, See Coherence scanning interferometer; Coherence scanning interferometry
Curves and related parameters,
256–259
Cylindrical capacitor,
116
D
Deep reactive ion etched structures,
303
Developed interfacial area ratio,
271
Differential interferometry,
102–103
Dimensionless quantity,
16–17
Displacement measurement,
36
Double-pass interferometry,
101–102
E
Eddy current displacement sensors,
116–118
Elastic compression,
49–50
Electrical resistivity measurement,
226–227
Electron backscattered diffraction,
229
Electrostatic force balance,
339
Elliptical polarisation,
68
Engineering nanometrology, ,
64
Equivalent viscous damping,
58
European nanotechnology,
Expanded uncertainty,
26,
104
F
Feature attribute statistics,
281
Field programmable gate array,
100–101
Five point peak height,
282
Five point pit height,
282
Fizeau interferometer,
74–77
Focus variation instrument,
162–164
Free spectral range,
80,
103
Frequency-stabilised laser,
28
Full width at half maximum,
156
Fundamental physical constants,
14–15
G
Gauge block interferometer,
80–91,
89
Gaussian distribution,
25,
26
Gaussian probability function,
245–246
Gradient density function,
274
Gravitational wave detector,
55
Guide to the Expression of Uncertainty in Measurement,
22–23
H
Hardware fringe counting,
100
Heisenberg’s Uncertainty Principle,
19–20
Helium ion microscope,
235
I
Interfacial surface roughness,
172
Interference microscopy,
148
Inter-molecular forces,
207
International Organization for Standardization,
International Prototype of the Kilogram,
14
Inverse areal material ratio,
271
Iodine-stabilised He-Ne laser,
31,
31f
Ion accumulation approach,
334
J
K
Korea Research Institute of Standards and Science,
339
Kurtosis of the assessed profile,
255
Kurtosis of topography height distribution,
269
L
Laser frequency stabilisation,
30–33
Laser frequency standards,
35–36
Laser interferometer-based micro-CMMs,
305–306
Laser interferometer-based nano-CMM,
306–307
Lateral Electrical Nanobalance,
343–344
Lateral resolution,
21,
76
Law of propagation of uncertainty,
25
Lennard-Jones potential,
221
Levitated superconductor approach,
334
Linear fractal complexity parameter,
284–285
Linear interpolation,
284,
288
Linear variable differential transformer,
117
Linescale-based micro-CMMs,
304–305
M
Mach-Zehnder interferometer,
77–78
Material ratio of the profile,
256
Maximum height of the profile,
250
Maximum height of the surface,
269
Maximum pit height of the surface,
269
Maximum profile peak height,
249–250
Maximum profile valley depth,
250
Maximum surface peak height,
269
Mean height of the profile elements,
250–251
Mean width of the profile elements,
255–256
Measurements in the nanometre,
Mechanical comparators,
65
Mechanical micro-CMM probes,
308–310
Method of exact fractions,
84
Metrology frame, thermal expansion of,
104
Michelson interferometer,
55,
72
Micro- and nanotechnology,
Microelectromechanical systems,
15–16,
303
Microscope objective,
147,
158
Morphological filters,
263
Multi-wavelength interferometry uncertainty,
89
N
Nanomaterials,
Nanotechnology markets,
National Institute of Standards and Technology,
National Measurement Institute,
National Metrology Institute of Japan,
National Nanotechnology Initiative,
National Physical Laboratory,
Non-cumulative error,
104
Numerical wavefront propagation algorithm,
169
O
Optical beam deflection,
210
Optical lever sensitivity,
219
Optical transfer function,
191
Optomechanical micro-CMM probes,
312–314
P
Passive vibration isolation,
56–58
Peak material volume,
273
Performance verification,
301
Phase change correction,
88f,
90
Phase change on reflection,
150
Phase sensitive detection,
173
Phase-unwrapping algorithm,
164–165
Physikalisch-Technische Bundesanhalt,
Piezoelectric actuator,
125
Piezoresistive cantilever,
342
Piezoresistive strain element,
341–342
Piezoresistive strain sensors,
114
Pneumatic instruments,
175
Point autofocus instrument,
160
Point spread function,
191
Position-sensitive detector,
319–320
Principle of superposition,
68
Prismatic slideway,
46–47
Probability density function,
258
Probability distribution,
23–25
Profile and areal characterisation,
289–290
Profile calibration artefact,
178
Profile height amplitude curve,
258–259
Profile measuring instruments,
178–179
Profile section height difference,
257
Profile specification standards,
259–261
PSD
See Position-sensitive detector; Power spectral density
PSI
See Phase-shifting interferometer; Phase-shifting interferometry
Q
Quantity of dimension one,
16–17
R
Random error sources,
109
Reference data files,
193
Relative length parameter,
286
Robust Gaussian filter,
262
Root mean square deviation of the assessed profile,
253–254
Root mean square gradient,
270
Root mean square value of the ordinates,
268
S
Scanning electron microscope,
228–230
Scanning near-field optical microscope,
207
Scanning optical techniques,
152–161
Scanning spreading resistance microsocopy,
226–227
Scanning thermal microscopy,
226
Segmentation filters,
264
Seismic vibration spectrum,
55
Sensitivity coefficients,
26
Shearing interferometry,
77
Silicon-based micro-CMM probes,
310–312
Single-mode laser wavelength stabilisation schemes,
30
Skewness of the assessed profile,
254–255
Skewness of topography height distribution,
268
Smooth–rough crossover,
284
Software measurement standard,
192–193
Sound pressure attenuation,
59
Spatial frequency response,
191–192
Standard uncertainty,
16,
23
Stratified functional properties,
260–261
Structured light projection,
155
Stylus qualification,
296
Subdivision calibration process,
336
Surface profile measurement,
139–140
Surface texture parameters,
139–140
Swept-frequency interferometry,
103–104
Système International d’Unitès,
9–10
T
Temperature measurement,
89
Texture aspect ratio,
270
Texture feature selection,
275
Thermal conductivity,
52–53
Thermal distortion,
52–53
Thermal expansion coefficient,
51
Total height of the surface,
251
Total integrated scatter,
173
Total internal reflectance,
120–121
Total traverse length,
244
Traceability in length,
64–65
Traceable measurements,
36
Triangulation sensors,
154
Twyman-Green interferometer,
72–74
U
Unified coordinate system,
267
V
Vacuum wavelength uncertainty,
89
van der Waals forces,
222
Vertical scanning white light interferometry,
169–170
Vibrating micro-CMM probes,
314–316
Volumetric error compensation,
300
W
Wavelength at 50% depth modulation,
150
Welch-Satterthwaite formula,
26
White light interference,
70–72
White light scanning interferometry,
169–170
X
Y
Z
Zeeman-stabilised laser,
33–34