List of Examples

Example 3.1: Calculation of Inductances Associated with the Decoupling Capacitor and IC Device in a PCB

Example 5.1: Measurements and Graphical Method Applied to an Interconnection with TTL Devices

Example 6.1: Point-to-Point Structure

Example 6.2: Chain Structure

Example 6.3: Two Coupled Lines with Linear Loads

Example 6.4: Two Coupled Traces with TTL Devices in a Point-to-Point Test Board Structure

Example 6.5: Two Coupled Lines in a Bus Test Board Structure

Example 6.6: Five Coupled Lines with Non-linear Loads

Example 7.1: Trace with 50 Ω Characteristic Impedance

Example 7.2: Signal Integrity in a Lossy Coaxial Cable

Example 7.3: Signal Integrity in a Lossy UTP Cable

Example 7.4: Eye Diagram of a 75m Unshielded Twisted-pair Cable Driven by an RS422 Device

Example 7.5: Coaxial Cable Driven by an Ultrawide-band Signal Simulated by the TL Model Based on the Time-domain S-parameters

Example 8.1: Switching Noise Simulations of Two Stripline and Microstrip Structures

Example 8.2: Test Board for Prediction of Power Bus Impedance by Several Methods

Example 8.3: Measurements and Simulations with Standard Buried Capacitance (SBC) Test Boards

Example 9.1: Computations and Measurements of a Clock Spectrum

Example 9.2: Calculations and Measurements of Emission Produced by P-Test Boards

Example 9.3: Calculations and Measurements of Emission from S-Test Boards

Example 9.4: Calculations and Measurements of Emission from A-Test Boards

Example 9.5: Calculations and Measurements of Emission from Multilayer SBC-Test Boards

Example 9.6: Calculations and Measurements on a Test Board Equipped with CMOS Devices Interconnected by a Star Structure

Example 9.7: Calculations and Measurements of Emission from Simple Test Boards (P-Boards) with an Attached Cable

Example 9.8: Calculations and Measurements of Emission from S-Test Boards with an Attached Cable

Example 9.9: Calculations and Measurements of Emission from A-Test Boards with an Attached Cable

Example 9.10: Calculations and Measurements of Emission from SBC-Test Boards with an Attached Cable due to the Voltage-driven Mechanism

Example 9.11: Calculations and Measurements of Emission from D-Test Boards with Differential Drivers and Receivers Interconnected by UTP and SFTP Cables

Example 9.12: Measurements of Emission from a Shielded Rack Equipped with PCBs and Power Supply

Example 9.13: Calculations and Measurements of Radiated Emission from a Coaxial Cable

Example 9.14: Measurements of Radiation from UTP Cable Filtered with a Common-mode Choke

Example 9.15: Calculations and Measurements of Radiation from P-Test Boards within a Shielded Rack with a Rectangular Aperture

Example 9.16: Measurement of Radiated Emission Patterns from Telecommunication Equipment

Example 9.17: Computation of Radiation from a Wire above a Finite Ground Plane with an Attached Cable

Example 10.1: Computation of Transfer Impedance for Several Interconnection Structures

Example 10.2: Current Distribution and Radiation Pattern for Microstrip- and Stripline-like Structures

Example 10.3: Calculation of the Noise in a Connector with an ECL Device

Example 10.4: Calculation of Noise in a Connector using SPICE

Example 10.5: Measurements of Transfer Impedance for Three Test Connectors

Example 10.6: Measurements of Radiation from a Test Cable with a Pigtail

Example 10.7: Numerical Simulations of a Test Board with an Attached Cable

Example 10.8: S-parameter Measurements and Simulations of a Test Board with a Split

Example 10.9: S-parameter Measurements and Simulations of a Test Board with an Island

Example 11.1: Simulation of TDR Measurements Assuming a Trace in a PCB as the DUT

Example 11.2: Simulation of TDR Measurements Assuming aVia as the DUT

Example 11.3: Transmission-line Parameter Extraction of a Simple Connector

Example 11.4: Lumped-circuit Element Extraction of a Simple Via

Example 11.5: Radiated Emission Measurements from a Rack in Two Different Semi-anechoic Rooms

Example 11.6: Modeling a Radiating Loop in a Semi-anechoic Room

Example 12.1: LVDS Signal Integrity and Common-mode Rejection Investigation by Measurements

Example 12.2: LVDS Crosstalk Investigation by Simulations

Example 12.3: Characterization of a Backplane for High-speed Application up to 3.125 GHz by Measurements

Example 12.4: Numerical Simulation of the Distortion Introduced on Signals by a Slot in the Ground Plane

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