Index
A
ablation techniques,
42–4
additive processing,
74–5
adhesive microneedle backing,
258,
259
advanced microfabrication methods,
55–89
micro-ceramic processing,
59–70
non-silicon hybrid devices,
71–4
planar lightwave circuits,
74–80
silicon hybrid devices,
71–4
speciality substrates,
71
Advanced Silicon Etching (ASE),
59
aluminium support frames,
162–3
amorphous materials:
micromechanical transducers,
154
photostructurable glass,
36–8
planar lightwave circuits,
77
anisotropic etching:
micro-mechanical actuation,
208
photostructurable glass,
36,
37
aqueous microneedle conduits,
252
artificial oxide nanoarrays,
123–4
artificial oxygenation,
129
ASE (Advanced Silicon Etching),
59
atomic layer deposition (ALD),
170–1
automotive sensor technology,
155
B
basic microsystem technologies,
13–54
non-silicon processing,
33–49
silicon micromachining,
21–32
batch fabricated quartz resonators,
33,
35
batch processing of packaged sensors,
157
batch-type microfluidic approaches,
202–3
bimetallic actuator structures,
209–10
biochemical sensor information,
183–9
biochip technology,
191–2
bio-inspired oxide nanoarrays,
129–30
application fields,
180–2
biochemical information,
183–9
development methodology,
188–9
electrochemical arrays,
190–5
integrated chemFET devices,
189–90
integrated clinical diagnostics,
190–5
MST foundry service industry,
84
templated nanoarrays,
110
biomedical devices (nanomaterials),
124
biomimetics/biomimickry,
92,
130
biomolecular recognition,
151–2
bio-templated oxide nanoarrays,
129–30
blood:
BOE (buffered oxide etch),
22
bonding-and-etchback techniques,
71
BOSCH pressure sensors,
151
BOSCH Reutlingen facility,
151,
152
bottom antireflection coating (BARC),
117–18
bromine-based gas mixtures,
26
buffered oxide etch (BOE),
22
bulk quartz/silicon micromachining,
28–32,
33,
34
buried oxide layers (BOX),
71
C
CAD (computer aided design),
16
cantilever components,
162–3
capacitive packaged sensors,
157
capillary electrophoresis (CE),
219–28
CE (capillary electrophoresis),
219–28
cell sorting devices,
215,
216
cement model systems,
63,
64
ceramics:
curved substrate patterning,
67–9
nanoscale resolution patterning,
69–70
soft-mold replication,
66–7
Ceraset Polysilazane (PSZ),
66–7
Cercanam (ceramic precursor),
68
application fields,
180–2
biochemical information,
183–9
cell-based biosensors,
192–5
development methodology,
188–9
electrochemical arrays,
190–5
integrated chemFET devices,
189–90
integrated clinical diagnostics,
190–5
chemical vapour deposition (CVD),
19–20,
169
chlorine-based gas mixtures,
26
chromium pattern transfer etch masks,
128–9
chucks (wafer dicing),
158
cleanroom facilities:
vapor deposition techniques,
20
clinical sensor diagnostics,
190–5
colloidal nanocrystals (NCs),
154
colloidal self-assembly,
112
complementary metal oxide semiconductor (CMOS) technology,
81,
192–3,
195
compliance sensor technology,
155
composite oxide nanoarrays,
124,
125
compressed air systems,
159
computer aided design (CAD),
16
computer-assisted microneedle design studies,
264
conducting metal oxides,
127
confined synthesis templated techniques,
112
continuous nanoarray layouts,
97,
98
couplers (micromechanical),
162–5
cryo-Deep Reactive Ion Etching,
59
curved substrate ceramic patterning,
67–9
D
Datalogic Magellan 8500XT barcode scanners,
166
deep dry etching techniques,
21–2
Deep Reactive Ion Etching (DRIE),
59,
60
deoxyribonucleic acid (DNA):
micromechanical transducers,
152
device-to-world connections,
217–19
diaphragms:
micro-mechanical actuation,
209
micromechanical couplers,
162–5
digital projectors and displays,
166,
167
direct microneedle approaches,
257–8
direct-write photolithography strategies,
17
direct-write scanning probe lithography,
101–2
discontinuous nanoarray layouts,
97,
98
disposable cytometers,
215,
216
disposable microneedle retainers,
258,
259
dissolving polymer microneedle arrays,
245,
246
DNA:
micromechanical transducers,
152
double-side quartz etching processes,
33,
34,
35
drinking water supply networks,
184–5
dry surface micromachining,
76
E
ECR (electron cyclotron resonance),
59
egg-shell membranes (ESM),
129
electrical-field assisted nanofabrication,
109
electrochemical etching,
248
electrochemical oxide nanoarray processes,
128
electrodisposition batch-replication,
260–1
electromagnetic actuators,
209
electron cyclotron resonance (ECR),
59
electronics industry,
103–4
electro-optic substrates,
71
electroosmotic fluid flow,
212
electrostatic actuation,
26,
27,
156
emerging nanolithographic technologies,
107–12
environmental pollution,
182
epitaxial deposition,
169
epoxy-type photoresists,
40,
41
e-reading head-set systems,
166,
167
ESM (egg-shell membranes),
129
etched-released machined gear wheels,
26,
27
etching techniques:
Laser Interference Lithography,
117–18
micro-mechanical actuation,
208
non-silicon processing,
33–6
photostructurable glass,
36,
37
planar lightwave circuits,
75,
76
ethylenediamine perizine (EDP),
29,
161
excimer laser ablation,
44
F
Faradic impedance spectra (FIS),
192,
193
femtosecond laser micromachining principle,
44
fermentation processes,
217
fiber-(electro)spinning,
154–5
FIB (focused ion beam milling),
128–9
fine-grained polysilicon layers,
161
fine mechanically manufactured arrays,
241
fine-mechanical microneedle approaches,
257–8
finger stick sampling,
223
FIS (Faradic impedance spectra),
192,
193
flip-flop splitter elements,
206,
207
flow-through cells,
184–5
flow-through devices,
201
flow-through microfluidic concepts,
202–3
fluorescent-activated cell sorters (FACS),
215,
216
fluorine-based gas mixtures,
26,
32
fluorometric sensors,
183
focused ion beam (FIB) milling,
128–9
foundries (microsystems),
29
foundry service industry,
83–4
free-standing microgears,
66,
67
fused glass/silica materials,
154
G
gallium arsenide (GaAs) substrates,
153
galvanoforming processes,
41–2
gases:
dry etch mixtures,
26,
27
micro-mechanical actuation,
209
geometrically constrained inorganic templates,
111
Germanium-doped silica layers,
81–2
glass:
cantilever components,
162–3
micro-ceramic processing,
70
micromechanical transducers,
154
planar lightwave circuits,
77
glass transition temperature (Tg),
45–6
glucose oxidase (GOx),
126
gold interdigital electrode arrays,
192
guided self-assembly,
112
H
head-mounted retina displays,
166,
167
high-contrast negative resists,
118,
119
highly ordered oxide films,
128
highly ordered pyrolytic graphite (HOPG),
123
high-resolution nanoarrays,
107
HIV drug resistance evaluation,
202
hybrid-integrated glass cantilever components,
162–3
hydraulic microactuators,
206
hydrofluoric acid (HF),
34–36
I
ICP (inductively coupled plasma) sources,
32
inductively coupled plasma (ICP) sources,
32
inductively coupled reactive ion etching,
59,
60
information storage device nanofabrication,
72
information technology (IT),
165–72
infrared (IR) plastic microfabrication,
45
injection micromolding,
48,
49
integrated boss-features,
162
integrated chemFET devices,
189–90
integrated clinical diagnostics,
190–5
integrated fabrication (surface micromachining),
26
integrated microfluidic devices,
211–12
integrated microneedle-micropump patches,
263,
264,
265
integrated microneedle skin patches,
250,
251
integrated optical devices:
MST foundry service industry,
83–4
silicon/non-silicon hybrid devices,
72–4
integrated wearable scanners,
166
interdigital electrode (IDE) arrays,
192
in vitro pharmaceutical testing,
202
in vivo pharmaceutical testing,
202
ion beam techniques,
17,
107
ion selective electrode (ISE) measurements,
222,
227
ion-sensitive field-effect transistors (ISFET),
189–90
ISE (ion selective electrode) measurements,
222,
227
IT (information technology),
165–72
K
KOH (potassium hydroxide),
22,
29
L
label-free nanoarrays,
107
large scale integration (LSI),
19
laser-based planar lightwave circuits,
74–5
laser scanning systems,
166–7
laser silicon/non-silicon hybrid devices,
73–4
laser stereolithography,
17
layered composite oxide nanoarrays,
124,
125
lead zirconate titanate (PZT),
156,
255
leak-tide integration,
212
Leiden/Amsterdam Center for Drug Research (LACDR),
242
light-emitting diode-based detectors,
184–5
light sensitive compounds,
15
lithography:
electronics industry,
103–4
low-loss alumina waveguide fabrication,
170–1
Low Pressure Chemical Vapour Deposition (LPCVD),
19,
22,
161–2
low-shrinkage ceramic precursors,
68
M
Mach-Zehnder interferometers,
81,
82,
84,
184
magnetron sputtering,
170
mammalian cell-based sensors,
192–3,
195
maskless extreme ultraviolet lithography,
113–14
masks:
excimer laser ablation,
44
planar lightwave circuits,
74–5
silicon micromachining,
21–2
master-based replication processes,
260–1
MATAS (Modular Assembly for (micro) Total Analysis systems),
217–19
medical ordered oxide applications,
130–2
medical sensor array applications,
190–5
membrane-type materials,
187
metals:
meta-materials:
nanoscale research,
125–7
oxide metamaterials,
124–7
micro-abrasive blasting,
38–9
microarray sensor technology,
190–5
micro-ceramic processing,
59–70
curved substrate patterning,
67–9
nanoscale resolution patterning,
69–70
soft-mold replication,
66–7
microchip-based cytometers,
215,
216
microchip capillary electrophoresis,
219–28
microelectronics industry,
103–4
application fields,
201–4
micro-hot embossing,
46–9
micromechanical actuation,
208–10
micromechanical transducers,
147–77
application fields,
150–3
information technology,
165–72
resonant microdevices,
160–5
thick/thin film hybrid materials,
154–5
micro-mirror integrated digital projectors and displays,
166,
167
micromolded ceramics,
60–2
micromolded dissolving polymer microneedle arrays,
245,
246
micromolding in capillaries (MIMIC),
63–6
Microneedle Array (MNA) Technology,
237–65
microfabrication technologies,
244–52
Micronics microchip-based cytometers,
215,
216
Micro (Opto) Electro Mechanical Systems (MEMS/MOEMS):
bulk quartz micromachining,
33,
34
information technology,
165–72
integrated optical devices,
170
microfluidic components,
206
micromechanical actuation,
209
micromechanical transducers,
163
Microneedle Array Technology,
241,
245
multiple-beamlet arrays,
107
photostructurable glass,
36
silicon/non-silicon hybrid devices,
73
surface micromachining,
27,
28
microplate readers,
181–2
microscale aqueous microneedle conduits,
252
microstereolithography,
44–5,
60
microsystem foundries,
29
MIMIC (micromolding in capillaries),
63–6
Mirkin Research Group,
101–2
mirror integrated digital projectors and displays,
166,
167
mirror projection displays,
167
mixers (microfluidics),
205
Modular Assembly for (micro) Total Analysis systems (MATAS),
217–19
molecular recognition,
151–2
monolithic integration,
169,
171
More-than-Moore concepts,
165
Motorola WT4000 scanners,
166
mounted diaphragms,
162–3
mounted single-use chips,
228
MST foundry service industry,
83–4
multi-electrode arrays,
192,
193
multiple e-beam/ion-beam lithography,
107
multi-user MEMS processes (MUMPS),
28,
168
N
oxide metamaterials,
124–5
template-free lithography,
103
nanograting pattern fidelity,
118,
119
nanohole-microarrays,
119
nanoimprint lithography (NIL),
99,
114–15
nanolithography:
bottom-up/top-down approaches,
94,
95–104
electronics industry,
103–4
nanoporous microneedles,
248–50
nanoscale meta-material research,
125–7
nanoscale resolution ceramic patterning,
69–70
natural oxide nanoarrays,
123–4
NCs (colloidal nanocrystals),
154
NIL (nanoimprint lithography),
99,
114–15
non-CMOS compatible cantilever devices,
163
non-lithographic direct shaping methods,
17
non-silicon hybrid devices,
71–4
non-silicon processing,
33–49
photostructurable glass,
36–8
plastic microfabrication,
39–49
novel diagnostic nanoarrays,
131
novel product nanofabrication,
235–72
O
octadecyltrichlorisilane (OTS),
69
octadecyltrichlorsilane (ODTS),
130
on-chip fluidic networks,
185,
203
on-chip optical absorbance,
185
on-chip polymerase chain reaction,
203
OPC (Ordinary Portland Cement),
62,
63,
64
optical devices:
information technology,
167–72
MST foundry service industry,
83–4
silicon/non-silicon hybrid devices,
72–4
optical films (planar lightwave circuits),
79,
80
Ordinary Portland Cement (OPC),
62,
63,
64
organic-capped iron-oxide (Fe
2O
3),
154
organic oxide arrays,
123
OTS (octadecyltrichlorisilane),
69
out-of-plane mirror elements,
166
oxide metamaterials,
124–7
oxide nanoarrays:
fabrication principles,
127–30
lithographic-assisted,
128–9
P
parallel electron beam techniques,
17
parallel plate plasma etching,
25
parallel templated nanoarrays,
110
partially self-dissolving microneedles,
263,
264,
265
passive microvalves,
206–7
patterned magnetic (PM) media,
105,
106
p-CAR pattern transfers,
117–18
perovskite lead zirconate titanate structures,
156
photo-etched devices,
36,
37
photonic nanostructures,
130
photopolymerization,
44–5
photostructurable glass,
36–8
physical vapour deposition (PVD),
19–20,
169
piezoelectric actuators,
209
piezoelectrical materials,
33
piezoelectric discs,
162–3
piezoresistive packaged sensors,
157,
158
planar flow-through cells,
184–5
planar lightwave circuits (PLCs),
74–80,
169
plasma deposition processes,
26
plasma-enhanced chemical vapour deposition (PECVD):
plasma polymerization,
78
plastic encapsulation,
158
plastic microfabrication,
39–49
photopolymerization,
44–5
thermoplastic micromolding,
45–9
thick resist lithography,
40–2
plastic microneedles,
247
pneumatic microactuators,
206
point-of-care (PoC) microfluidics,
220
point-of-care (PoC) tests,
222
point-of-sales bar code readers,
166
polycrystalline oxide nanoarrays,
124,
125
ceramic micromolding,
65,
66
curved substrate patterning,
67–9
micro-mechanical actuation,
208–9
microneedle arrays,
263–4
plastic microfabrication,
40
soft-mold replication,
66
polyetheretherketone (PEEK),
43–4
Polymerase Chain Reaction (PCR),
203,
206
polymeric organic oxide arrays,
123
polymers:
photopolymerization,
44–5
planar lightwave circuits,
78–9
plastic microfabrication,
39–49
thermoplastic micromolding,
45–9
thick resist lithography,
40–2
polymethylmetacrylate (PMMA):
polytetrafluoroethene (PTFE),
124
portable scanning systems,
166–7
potassium hydroxide (KOH),
22,
29
pressure-driven microvalve flows,
206,
207
printed circuit boards (PCB):
micromechanical coupler diaphragms,
163
thermoplastic micromolding,
47,
48–9
proteins:
PSZ (Ceraset Polysilazane),
66–7
PTFE (polytetrafluoroethene),
124
Pulsed Laser Deposition (PLD),
20,
126–8
pumps (microfluidics),
205
purpose-built materials,
127
Q
R
random access memory (RAM),
106
rapid prototyping print processes,
154–5
RCOS (Resonant Cantilever Optical Scanner),
168,
171,
172
reactive ion etch (RIE) processes,
59,
60
optical device fabrication,
81
planar lightwave circuits,
76
receptor-ligand binding,
152
resist systems:
Laser Interference Lithography,
115–20
plastic microfabrication,
40–2
wet deposition techniques,
18
Resonant Cantilever Optical Scanner (RCOS),
168,
171,
172
resonant microdevices,
160–5
resonant mirror components,
167–8
resonant scanners,
33,
34
resonant systems (diaphragms),
163,
165
resonant tuning forks,
33,
35
retail barcode scanners,
166
reusable microneedle applicators,
258,
259
reverse iontophoresis,
223
rod-shaped Tobacco mosaic viruses,
130
S
sacrificial master-based replication,
260–1
sacrificial silica layers,
26–7
samples (microfluidics),
224–6
sample to chip interfaces,
224
sapphire (A
2O
3) substrates,
153
SBL (styrene butadiene copolymer latex),
62
scanning electron micrography (SEM),
117–18
selective electrochemical etching,
248
self-assembled monolayers (SAMs),
69,
70,
129
self-dissolving microneedles,
263–4,
265
semiconductors:
optical device fabrication,
81
silicon/non-silicon hybrid devices,
73–4
sensors:
application fields,
180–2
biochemical information,
183–9
cell-based biosensors,
192–5
development methodology,
188–9
electrochemical arrays,
190–5
integrated chemFET devices,
189–90
integrated clinical diagnostics,
190–5
resonant microdevices,
161–2
sharp-tip silicon microneedle arrays,
245,
246
signal transduction systems,
182
silica:
micromechanical transducers,
154
silicon:
bulk micromachining,
28–32
information technology,
169–71
micromachined arrays,
241
micromechanical actuation,
208
planar lightwave circuits,
77
silicon carbide (SiC),
64,
66
silicon dioxide etching,
76
Silicon-on-Insulator (SOI) speciality devices,
71
single-stranded DNA (ssDNA),
109
single-wall carbon nanotubes (SWNTs),
109
sintered ceramic microgears,
66,
67
small-molecule-releasing skin patches,
251,
252
SMD (surface mounted devices),
151
soft-mold replication,
66–7
SOI (Silicon-on-Insulator speciality devices),
71
speciality substrates,
71
spin-on-glass processes,
169
splitter-type elements,
206
spot-size transformers,
169
SPR (surface plasmon resonance),
127
SRAM (static random access memory),
106
ssDNA (single-stranded DNA),
109
stainless steel laser cut microneedle arrays,
245,
246,
247
static random access memory (SRAM),
106
steel laser cut microneedle arrays,
245,
246,
247
storage device nanofabrication,
72
styrene butadiene copolymer latex (SBL),
62
SU-8 epoxy-type photoresists,
40,
41
subtractive pattern transfers,
74–5
surface acoustic waves (SAW),
71,
106–7
surface micromachining,
25–8
information technology,
167–8
micro-mechanical actuation,
210
planar lightwave circuits,
76
surface mounted devices (SMD),
151
surface plasmon resonance (SPR),
127
surface-released machined gear wheels,
26,
27
surgery microfluidics,
220–2
SWNTs (single-wall carbon nanotubes),
109
T
TBAF (tetrabutylammoniumfluoride),
66
temperature:
micromechanical transducers,
156–7
template-free lithography approaches,
103
tetrabutylammoniumfluoride (TBAF),
66
tetrahydrofuran (THF),
66
tetramethylammonium hydroxide (TMAH),
22,
29
text-recognition systems,
166,
167
therapy (nanoarrays),
131–2
thermoplastic micromolding,
45–9
thermosetting polymers,
40
THF (tetrahydrofuran),
66
thick film hybrid materials,
154–5
thick resist lithography,
40–2
integrated optical devices,
74
magnetron sputtering,
170
micro-mechanical actuation,
208
planar lightwave circuits,
79,
80
vapor deposition techniques,
18–21
wet deposition techniques,
18
three-dimensional architectural protein templating,
110–11
three-dimensional masking,
21–2
three-dimensional microstructures,
41
three-dimensional sensor cellular networks,
194,
195
three-sides clamped diaphragms,
163,
164,
165
time-to-market transit,
105
TMAH (tetramethylammonium hydroxide),
22,
29
Tobacco mosaic viruses,
130
tuning fork resonators,
33,
35
two-photon photopolymerization approaches,
44–5
U
ultraviolet (UV):
plastic microfabrication,
41–2
V
valves (microfluidics),
205–10
Very Large Scale Integration (VLSI) electronics,
76,
104
visible light waveguides,
76–7
VLSI (Very Large Scale Integration),
76,
104
W
water supply networks,
184
wet deposition techniques,
18
wet surface micromachining,
76
X
Z