Abbreviations
- ACLD
- Active constrained layer damping
- APDC
- Active piezoelectric damping composites
- ATF
- Augmented temperature field
- BVP
- Boundary value problem
- CLD
- Constrained layer damping
- DMTA
- Dynamic mechanical thermal analysis
- DOF
- Degrees of freedom
- DPM
- Distributed‐parameter model
- EAP
- Electroactive polymers
- EDT
- Engineered damping treatments
- EMDC
- Electromagnetic damping composites
- FD
- Fractional derivatives
- FEM
- Finite element method
- FFT
- Fast Fourier transform
- FGM
- Functionally graded material
- GHM
- Golla–Hughes–MacTavish model
- G‐L
- Grunwald–Letnikov approach
- GMC
- Generalized method of cells
- HTM
- Halpin–Tsai method
- IDOF
- Internal degree of freedom of the VEM
- IRS
- Improved reduction system method
- KE
- Kinetic energy
- LFA
- Low frequency approximation method
- LMS
- Least mean square
- MCLD
- Magnetic constrained layer damping
- MDR
- Modal damping ratios
- MMA
- Method of moving asymptote
- MR
- Magnetorheological fluid
- MSE
- Modal strain energy
- MTM
- Mori–Tanaka method
- MWCNT
- Multi‐walled carbon nanotubes
- NSC
- Negative stiffness composite
- OC
- Open circuit
- P.E.
- Potential energy
- PCLD
- Passive constrained layer damping
- PVDF
- Polyvinylidene fluoride
- PZT
- Lead zirconate titanate
- R–L
- The Reimann–Liouville approach
- RVE
- Representative volume element
- SAFE
- Semi‐analytical finite element method
- SC
- Short circuit
- SCM
- Self‐consistent method
- SHPB
- Split Hopkinson pressure bar
- SOL
- Stand‐off layer
- TTS
- Time–temperature superposition
- VAMUCH
- Variational asymptotic method for unit cell homogenization
- VEM
- Viscoelastic material
- WLF
- Williams–Landel–Ferry formula
- WSM
- Weighted stiffness matrix method
- WSTM
- Weighted storage modulus method
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