Ethan C. Ahn, Department of Electrical Engineering, Stanford University, USA

Masakazu Aono, WPI Center for Materials Nanoarchitectonics, National Institute for Materials Science, Japan

Tetsuya Asai, Graduate School of Information Science and Technology, Hokkaido University, Japan

Behtash Behin-Aein, GLOBALFOUNDRIES Inc., USA

Benjamin F. Bory, Eindhoven University of Technology, The Netherlands

George Bourianoff, Components Research Group, Intel Corporation, USA

Geoffrey W. Burr, IBM, USA

An Chen, GLOBALFOUNDRIES Inc., USA

Donald M. Chiarulli, Department of Electrical and Computer Engineering, University of Pittsburgh, USA

György Csaba, University of Notre Dame, USA

Shamik Das, Nanosystems Group, The MITRE Corporation, USA

Denver H. Dash, Intel Science and Technology Center, USA

Supriyo Datta, Purdue University, USA

Vinh Quang Diep, Purdue University, USA

S. Burc Eryilmaz, Department of Electrical Engineering, Stanford University, USA

Yan Fang, Department of Electrical and Computer Engineering, University of Pittsburgh, USA

Scott Fong, Department of Electrical Engineering, Stanford University, USA

Aaron D. Franklin, Department of Electrical and Computer Engineering and Department of Chemistry, Duke University, USA

Paul Franzon, North Carolina State University, USA

Tsuyoshi Hasegawa, WPI Center for Materials Nanoarchitectonics, National Institute for Materials Science, Japan

Toshiro Hiramoto, Institute of Industrial Science, The University of Tokyo, Japan

James Hutchby, Semiconductor Research Corporation, USA

Louis Hutin, Department of Electrical Engineering and Computer Sciences, University of California, USA

Adrian M. Ionescu, Ecole Polytechnique Fédérale de Lausanne, Switzerland

Mahdi Jamali, University of Minnesota, USA

Rakesh Jeyasingh, Department of Electrical Engineering, Stanford University, USA

Alexander Khitun, Material Science and Engineering, University of California, USA

Angeline Klemm, University of Minnesota, USA

Takhee Lee, Department of Physics, Seoul National University, Korea

Steven P. Levitan, Department of Electrical and Computer Engineering, University of Pittsburgh, USA

Eike Linn, Institute of Electronic Materials II, RWTH Aachen University, Germany

Tsu-Jae King Liu, Department of Electrical Engineering and Computer Sciences, University of California, USA

Matthew J. Marinella, Sandia National Laboratories, USA

Hao Meng, Data Storage Institute, Singapore

Stephan Menzel, Peter Grünberg Institut (PGI-7), Forschungszentrum Jülich, Germany

Stefan C.J. Meskers, Eindhoven University of Technology, The Netherlands

Michael T. Niemier, University of Notre Dame, USA

Ferdinand Peper, Center for Information and Neural Networks, National Institute of Information and Communications Technology, USA

Wolfgang Porod, University of Notre Dame, USA

Mark A. Reed, Departments of Electrical Engineering and Applied Physics, Yale University, USA

Frank Schwierz, Technical University of Ilmenau, Germany

Hyunwook Song, Department of Applied Physics, Kyung Hee University, Korea

Narayan Srinivasa, Center for Neural and Emergent Systems, HRL Laboratories LLC, USA

Ken Takeuchi, Chuo University, Japan

Jian-Ping Wang, University of Minnesota, USA

Rainer Waser, Institute of Electronic Materials II, RWTH Aachen University, Germany; Peter Grünberg Institut (PGI-7), Forschungszentrum Jülich, Germany

H.-S. Philip Wong, Department of Electrical Engineering, Stanford University, USA

Victor V. Zhirnov, Semiconductor Research Corporation, USA