° angular measure; degree

°C degree Celsius/centigrade

°F degree Fahrenheit

BGA micro Ball Grid Array

3DPM 3 Dimensional Packaging Module

A ampere

AAGR average annual growth rate

ABS Acrylonitrile-Butadiene-Styrene (plastic)

ac alternating current

AC alternating current

ACI automatic component insertion

AEC architecture, engineering, and construction

AFNOR Association Française de Normalization

AGV automatic guided vehicle

AI artificial intelligence

AIS adhesive interconnect system

ANOVA analysis of variance

ANSI American National Standards Institute

AOI automatic optical inspection

AOQ average outgoing quality

APT automatically programmed tools

AQL acceptable quality level

ARPA Advanced Research Projects Agency

ASCII American Standard Code for Information Interchange

ASIC application specific integrated circuit

ASM American Society for Metals

ASME American Society of Mechanical Engineers

ASQC American Society for Quality Control

ASTM American Society for Testing Materials

at. % atomic percent

ATE automatic test equipment

ATG automatic test generation

atm atmospheres

AWG American Wire Gauge

BGA ball grid array; bumped grid array

BITE built-in test equipment

BOM bill of material

BS boundary scan

BTAB bumped tape-automated bonding

C4 controlled collapse chip connection

CAD computer aided design

CAE computer aided engineering

CAFM computer aided facilities management

CAGE commercial and government entity

CALS computer aided acquisition and logistic support

CAM computer aided manufacturing

CAPP computer aided process planning

CAR computer aided repair

CASE computer aided software engineering

CAT computer aided testing

CBGA ceramic ball grid array

CCA circuit card assembly

CCAPS circuit card assembly and processing system

CCD closed captioned device

CFC chlorofluorocarbon

cfh cubic feet per hour

CFM continuous flow manufacturing

cfm cubic feet per minute

CIC condensation inert curing

CIH condensation inert heating

CIM computer integrated manufacturing

CIS condensation inert soldering

CLCC ceramic leaded chip carrier

CMA circuit mil area

CMOS complementary metal oxide semiconductor

CNC computer numerical control

COB chip-on-board

COD consumed oxygen demand

Cp capability performance

CPBGA cavity plastic ball grid array

CPI continuous process improvement

CPL capability performance—lower

CPU capability performance—upper

CPU central processing unit (computer)

CRT cathode ray tube

CSA Canadian Standards Association

CSP chip scale package

CSP chip size package

CTE coefficient of thermal expansion

D diameter

dB decibel

dc direct current

DC direct current

DFM design for manufacturability

DFMA design for manufacturability and assembly

DFT design for test

diam diameter

DIL dual inline

DIN Deutsches Institut für Normung

DIP dual inline package

DNC direct numerical control

DOD Department of Defense

DOS disc operating system

dpm defects per million

DRAM dynamic random access memory

DRC design rule checking

DUT device under test

DVM digital voltmeter

ECAD electronic computer aided design

ECCB Electronic Component Certification Board

ECL emitter coupled logic

ECN engineering change notice

ECO engineering change order

EDA electronic design automation

EDF electronic design interchange format

EIA Electronic Industries Association

EIAJ Electronics Industry Association in Japan

EIS engineering information system

EMC electromagnetic compatibility

EMF electromotive force

EMI electromagnetic interference

EMP electromagnetic pulse

EMPF Electronics Manufacturing Productivity Facility

EPA Environmental Protection Agency

ESD electrostatic discharge

ESS environmental stress screening

FAA Federal Aviation Administration

FAC forced air convection

FAR failure analysis report

FCC Federal Communications Commission

FCC flat conductor cable

FCT functional test card

FEA finite element analysis

FEM finite element modeling

FET field effect transistor

FLT full liquidus temperature

FOP fineness of print (stencil)

FPBGA fine pitch ball grid array

FPT fine pitch technology

FTIR Fourier transform infrared spectroscopy

GaAs gallium arsenide

HAL hot air leveling

HASL hot air solder leveling

I/O input/output

IC integrated circuit

ICAM integrated computer aided manufacturing

ICEA Insulated Cable Engineers Association

ICT in-circuit testing

ID inner diameter

IEC International Electrotechnical Commission

IECQ International Electronic Component Qualification System

IEEE Institute of Electrical and Electronic Engineers

IEPS International Electronic Packaging Society

ILB inner lead bonding

IMC intermetallic compound

IPC Institute for Interconnecting and Packaging Electronic Circuits

ipm inches per minute

IR infrared

ISA Instrument Society of America

ISHM International Society for Hybrid Microelectronics

ISO International Standards Organization

JEDEC Joint Electronic Device Engineering Council

JIT just in time

JTAG Joint Test Action Group

KGB known good board

KGD known good die

LAN local area network

LCCC leadless ceramic chip carrier

LCL lower control limit

LEO lands exposed only

LGA land grid array

LID leadless inverted device

LIF low insertion force

LN Deutsche Luft und Raumfahrt Norm

LSI large scale integration

MAP manufacturing automation protocol

MCAD mechanical computer aided design

MCAE mechanical computer aided engineering

MCB molded circuit board

MCM multi-chip module

MCM-C multi-chip module ceramic

MCM-D multi-chip module deposited

MCM-L multi-chip module laminate

MDA manufacturing defects analyzer

MELF metal electrode leadless face

MIL military

miniBGA mini ball grid array

MIR moisture insulation resistance

MLB multi-layer board

MLPWB multilayer printed wiring board

MOS metal oxide semiconductor

MRP manufacturing resource planning

MRP material requirement planning

MSI medium scale integration

MTBF mean time between failure

MTTF mean time to failure

MTTR mean time to repair

MVC most vulnerable component

NADCAP National Aerospace and Defense Contractors Accreditation Procedures

NASA National Aeronautics and Space Administration

NBS National Bureau of Standards

NC numerical control

NDT non-destructive testing

NEMA National Electrical Manufacturers Association

NFPA National Fire Protection Association

NIST National Institute for Science and Technology

NMR normal mode rejection

OA organic acid

OD outer diameter

OEM original equipment manufacturer

OLB outer lead bonding

OSHA Occupational Safety and Health Administration

P/I packaging and interconnection

PAC pad array carrier

PBGA plastic ball grid array

PCB printed circuit board

PGA pin grid array

PLCC plastic leaded chip carrier

PNP pick and place

ppb parts per billion

ppm parts per million

ppt parts per trillion

psi pounds per square inch

psia pounds per square inch absolute

psig gauge pressure in pounds per square inch (pressure relative to ambient pressure)

PTH plated through hole

PWB printed wiring board

QAS quality assessment schedule

QFP quad flat pack

QPL qualified products list

RA rosin fully activated

RAM random access memory

RMA rosin mildly activated

ROM read only memory

ROT reflow of through-hole

rpm revolutions per minute

RSA rosin super activated

SA synthetic activated

SAO stuck at 0

SA1 stuck at 1

scfh standard cubic feet per hour

SCRS single center reflow soldering

SEM scanning electron microscope/microscopy

sfm surface feet per minute

SI Système International d’Unités

SIP single in-line package

SIR surface insulation resistance

SLICC slightly larger than integrated circuit carrier

SMA surface mount assembly

SMART Surface Mount and Related Technologies (British SMT Organization & Suppliers)

SMC surface mount component

SMD surface mount device

SME Society of Manufacturing Engineers

SMOBC solder mask over bare copper

SMT surface mount technology

SMTA Surface Mount Technology Association

SO small outline

SOIC small outline integrated circuit

SOJ small outline j-lead (component)

SOL small outline large (body)

SOP small outline package

SOT small outline transistor

SOW small outline wide (body)

SPC statistical process control

SPRS single pass reflow soldering

SQC statistical quality control

SSOP slim small outline package

T temperature

TAB tape automated bonded

TBGA tape ball grid array

TCE thermal coefficient of expansion

TCP tape carrier package

TQFP thin quad flat pack

TQM total quality management

TSOP thin small outline package

TSSOP thin shrink small outline package

UCL upper control limit

UFPT ultra fine pitch technology

UL Underwriters Laboratories

UUT unit under test

V volt

VDE Verband Deutscher Elektrotechniker

VG Verteidigungsgerte Norm

VLSI very large scale integration

VOC volatile organic compound

vol volume

VPS vapor phase soldering

VSPA very small peripheral array

W watt

WI wettability index