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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Author Steffen Kroehnert , Beth Keser
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challengesEmbedded and fan-out wafer level packaging (FO-WLP) technologies have been developed acros....
Release Date 2019/02